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MATERIALS AND FINISHES OF THE SWITCHES


Insulators:
SILICONIZED CERAMIC: wafers and rotors 1P.
EPOXIGLASS LAMINATE: wafers 1V - 1VCS - 2V - 2VCS - 4V - 4VCS, rotors 1V - 1VCS.
PHENOLIC LAMINATE: plate 6RCS.
PHENOLIC FABRIC LAMINATE: insulating washers.
POLYESTER FILM: insulators between spring and contact pads on wafers 2V - 2VCS - 4V - 4VCS - 5VCS
8V - 8VCS.
GLASS FILLED NYLON 66: housings 3R - 10R - 11R, rotors 2V - 2VCS - 4V - 4VCS - 5VCS - 8V - 8VCS
plate 7VCS, spacers 1V - 1VCS - 2V - 2VCS - 4VCS - 5VCS - 9VCS.
NYLON 66: rotors 7VCS.
ACETALIC RESIN : housings 7VCS, rotors 9VCS.
ABS RESIN : housings 6RCS.
POLYCARBONATE: spacer and caps on switches 8V - 8VCS.
POLYETILENE: protection caps on switches 3R - 13R - 10R - 11R.

Conductors:
PHOSPHOR BRONZE BAND: all resilient contacts and pads' pressure springs on wafers:
2V - 2VCS - 4V - 4VCS - 5VCS - 8V - 8VCS
BRASS BAND: all non resilient contacts. COPPER: all contact pads, tracks on wafers 5VCS - 8V - 8VCS - 9VCS.
Sole finishing on active surfaces: GOLD PLATING 0,5µm cobalt-gold on 4µm nickel.

Hardwares: BRASS BAR: shafts and threaded bushings of all multi-wafers' switches.
HARDENED STEEL BAND: index springs.
STEEL PLATE: finishings 5µm NICKEL PLATING on balls, screws and springs.
TIN DIPPING PLATING on PCB terminals. 7µm TIN or ZINC PLATING on other parts.